Seiko 7C17 Uživatelský manuál stáhnout pdf (Strana 25)

Point Solder Voids:

Insufficient solder, also referred to as a “VOID” can be caused by several factors. These factors include:

a) Flux void in wire core b) Wire feed position

c) Iron tip position d) Burnt flux build-up on tip

e) Oxidized pad or terminal f) Poor thermal transfer (iron tip hole or worn plating

Solder Void Incomplete Coverage

Total missed joint, tip may have hit top poor thermal transfer from tip to terminal

of terminal possible worn tip or hole in tip

Iron Tip Issues:

The iron tips should be changed on a schedule rather than waiting until there are issues with solder quality.

Counter should be installed to determine the amount of cycles that each tip has soldered. Once a pre-

determined life has been set, the tip should be changed to prevent soldering issues from occurring.

Iron tips have a Tin electro-plate area on them. Over time, the feeding of the solder wire, the flux in the

solder as well as temperature and the terminal that the tip is contacting all have a negative impact on tip

life. Below are photos of a new tip and a badly worn tip with a hole worn in it.

Burnt flux residue can also negatively impact solder quality and create potential void situations. The iron

tips should be manually cleaned once per hour to remove the burnt flux residue (photo in center below).

When the flux builds up on the tip, it can actually prevent the tip making good contact with a terminal due

to the flux making contact with the terminal and not the tip surface.

When the plating wears or a hole has built up on the tip, the thermal “mass” of the tip is lost, which in turn

causes poor heat transfer. Changing the iron tip on a scheduled basis will prevent this from happening.

New BCV-1 Tip Burnt Flux Residue Tip with Hole Worn

Clean Lines & Plating Build-Up All Around Tip Loses Thermal “Mass”

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Seiko 7C17 Uživatelský manuál Strana 25